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Electrostatic Discharge (ESD) Packaging Markets Share
The global electrostatic discharge packaging market is projected to reach $7.1 billion by 2030, growing at a CAGR of 8.31% from 2022 to 2030.
WILMINGTON, DE, UNITED STATES, January 10, 2025 /EINPresswire / -- Allied Market Research recently published a new report on the electrostatic discharge (ESD) packaging market , which highlights various important aspects of the industry. The market is expected to achieve a value of $7.1 billion by 2030, having witnessed a worth of $3.5 billion in 2021. This indicates a remarkable CAGR of 8.31% during the projected period from 2022 to 2030. The report offers a holistic analysis of recent and upcoming trends, dominant market segments, regional outlook, key investment pockets, value chain evaluations, and an overview of the competitive scenario.
The AMR study explores the competitive environment using analytical tools such as Porter's Five Forces, providing a comprehensive understanding of market dynamics. Moreover, the report outlines key growth drivers, restraints, and investment opportunities, offering companies and shareholders valuable insights for making informed decisions.
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Essential Forces behind Market Expansion
The research report outlines the key factors that drive the expansion of the global electrostatic discharge (ESD) packaging market. The growth is attributed to the security provided for packaging electronic items and ensuring their safety. However, the high cost of packaging materials is restricting growth to some extent. On the other hand, the increased demand for these ESD packages from various end-use sectors, including defense and military, healthcare, automotive, industrial, and aerospace, presents new opportunities for industry expansion in the coming years. Understanding these factors permits companies to refine their strategies and succeed in the competitive market. Effective communication and coordination with the stakeholders help to build robust trust and eventually lead to long-term business relationships, which further enhance the market position of any firm.
Industry News & Updates
In June 2024, Nefab, a global industrial packaging provider, expanded its operations in Latin America with a new facility in Viña del Mar, Chile. The new facility caters to the growing need for sustainable packaging services and contract logistics in the region.
In July 2023, Smurfit Kappa opened its advanced integrated corrugated production facility in Rabat, Morocco. This is Smurfit Kappa's initial operation in North Africa, and the factory is powered by green energy.
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Technological Developments in Electrostatic Discharge (ESD) Packaging
Use of advanced ESD materials
The use of innovative materials has enhanced the efficiency of ESD packaging. These materials are established to safely and effectively dissipate static electricity, thereby safeguarding sensitive components throughout handling and transportation. Moreover, the development of ESD-safe plastics and films such as polyethylene (PE) and polyvinyl chloride (PVC) has been treated with conductive additives. For instance, ESD-safe poly bags contain conductive or static-dissipative properties that make sure that any electrostatic charge built up on the surface of the bag can be safely dissipated. This is particularly important for protecting integrated circuits and semiconductor devices during storage and shipment.
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Smart ESD packaging solutions
The advent of smart packaging technologies involves sensors and Internet of Things capabilities where environmental conditions of ESD-sensitive products are monitored. These aspects are able to track temperature, humidity, and electrostatic discharge levels in real time. Companies like Novatek International have developed ESD packaging solutions equipped with humidity and temperature sensors that relay data to a central system. This enables manufacturers to ensure that sensitive components are stored in optimal conditions and alerts them to potential breaches in ESD safety protocols. This smart packaging enhances security, helps maintain product integrity, and reduces the risk of damage throughout the supply chain.
To sum up, the AMR report on the electrostatic discharge (ESD) packaging market offers businesses and stakeholders valuable insights into market developments, growth drivers, and technological advancements. By utilizing this data, companies are able to refine strategies, improve product offerings, and foster innovation, thus strengthening market positions and enabling long-term success in the rapidly evolving ESD packaging sector.
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About Us
Allied Market Research (AMR) is a full-service market research and business-consulting wing of Allied Analytics LLP based in Portland, Oregon. Allied Market Research provides global enterprises as well as medium and small businesses with unmatched quality of "Market Research Reports" and "Business Intelligence Solutions." AMR has a targeted view to provide business insights and consulting to assist its clients to make strategic business decisions and achieve sustainable growth in their respective market domain.
We are in professional corporate relations with various companies, and this helps us in digging out market data that helps us generate accurate research data tables and confirms utmost accuracy in our market forecasting. Allied Market Research CEO Pawan Kumar is instrumental in inspiring and encouraging everyone associated with the company to maintain high quality of data and help clients in every way possible to achieve success. Each and every data presented in the reports published by us is extracted through primary interviews with top officials from leading companies of domain concerned. Our secondary data procurement methodology includes deep online and offline research and discussion with knowledgeable professionals and analysts in the industry.
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Allied Market Research
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MENAFN provides the information “as is” without warranty of any kind. We do not accept any responsibility or liability for the accuracy, content, images, videos, licenses, completeness, legality, or reliability of the information contained in this article. If you have any complaints or copyright issues related to this article, kindly contact the provider above.