Dupont And Zhen Ding Technology Group Sign Strategic Cooperation Agreement To Advance High-End Printed Circuit Board Technology Development

(MENAFN- PR Newswire)

SHENZEN, China, Oct. 29, 2024 /PRNewswire/ -- DuPont (NYSE: DD ) and Zhen Ding technology Group (Zhen Ding) (4958-TW) announced they have entered into a strategic cooperation agreement in advanced printed circuit board (PCBs) technology. The signing ceremony, held yesterday at the Shenzhen Avary Time Center, was attended by Charles Shen, Chairman, Zhen Ding; Yi Zhang, President of the Asia Pacific Region, DuPont; and Thean Ming Tan, Global Business Director for Laminates, DuPont.

Through this strategic partnership, DuPont and Zhen Ding will work to enhance end-user applications, advance cutting-edge research and development, improve material performance, and promote the sustainable development of the electronics sector. Furthermore, they intend to deepen their cooperation in advancing smart manufacturing, corporate governance, and sustainability initiatives.

"As a leader in the global PCB industry, Zhen Ding possesses significant technical expertise and is open to collaborations that drive industry development," said Yi Zhang, President, DuPont Asia Pacific Region. "DuPont is honored to partner with the best in the field to enhance customer service and unlock new innovative possibilities for the global electronics sector."

DuPont is an industry leader in advanced interconnects and thermal management, providing solutions for chip fabrication, packaging, PCBs, and assembly. These solutions are critical for fostering breakthrough innovations vital for advanced computing and artificial intelligence. DuPont is committed to being the partner of choice for its customers, addressing the evolving demands in sectors such as advanced packaging, high-end substrates, AI applications, automotive electronics, high-frequency communications, and data centers. Through materials innovation, DuPont delivers superior quality solutions that empower customers to succeed both now and in the future.

"As a global leader in the electronic materials industry, DuPont possesses robust R&D, reliable quality, manufacturing capabilities, and a stable global supply chain. These are core competencies that Zhen Ding highly values," said Charles Shen, Chairman, Zhen Ding Group. "In this partnership, both parties will integrate their respective resources, collaboratively explore growth opportunities, and exert a positive influence on the industry. Through comprehensive cooperation in the development of new materials and key technologies, we aim to address the industry's demand for the complex performance of advanced PCBs and foster future innovations."

About DuPont Electronics & Industrial
DuPont Electronics & Industrial is a global supplier of new technologies and performance materials serving the semiconductor, circuit board, display, digital and flexographic printing, healthcare, aerospace, industrial and transportation industries. From advanced technology centers worldwide, teams of talented research scientists and application experts work closely with customers, providing solutions, products, and technical services to enable next-generation technologies.

About DuPont

DuPont (NYSE: DD ) is a global innovation leader with technology-based materials and solutions that help transform industries and everyday life. Our employees apply diverse science and expertise to help customers advance their best ideas and deliver essential innovations in key markets including electronics, transportation, construction, water, healthcare and worker safety. More information about the company, its businesses and solutions can be found at . Investors can access information included on the Investor Relations section of the website at href="" rel="nofollow" dupon .

About Zhen Ding Technology Holding Limited
Zhen Ding Technology Holding Limited (Taiwan Stock Exchange: 4958) specializes in the research, development, production, and sales variety of products, including flexible printed circuit board (FPC) and surface mount assembly (SMA), substrate-likes PCBs (SLP), high-density interconnect (HDI) PCBs, ultra-thin Mini LED board, multilayer rigid printed circuit boards (RPCB) and IC substrates (ICS). These products are widely used in end products such as computer information, consumer electronics, communications networks, automotive electronics, AI server high-speed computing, optical module and medical applications. The company offers professional one-stop shopping, full-solution services to customer worldwide. For more detailed information, please visit the company website: .

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SOURCE DuPont

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