Global Semiconductor Packaging Materials Research Report 2023-2028: Miniaturization Of Electronic Devices Drives Growth, Iot Expansion Fuels Demand

(MENAFN- GlobeNewsWire - Nasdaq) Dublin, Oct. 09, 2024 (GLOBE NEWSWIRE) -- The "Global Semiconductor Packaging Materials market 2024-2028" report has been added to ResearchAndMarkets.com's offering.
The semiconductor packaging materials market is poised for significant growth, predicted to expand by USD 9.13 billion during the 2023-2028 period, with a compound annual growth rate (CAGR) of 5.3%. Innovations in technology and a sharp increase in demand across various sectors are the catalysts propelling this market forward.
Drivers and Opportunities
One of the primary factors driving the market is the progressive miniaturization of electronic devices alongside the expanding utilization of semiconductor ICs within the realm of IoT. The rise in global demand for consumer electronics and smart devices further bolsters this growth. Additionally, advancements in semiconductor material packaging technologies are enabling more efficient, smaller, and more powerful components, which are in high demand across a spread of industries.
Market Segmentation Insight
The segmentation of the semiconductor packaging materials market sheds light on where demand is currently focused. It details various materials used, including organic substrates, lead frames, bonding wires, and ceramic packages. It also assesses the end-user application spread across consumer electronics, automotive, medical devices, and telecommunications. Geographical segmentation identifies key regions contributing to market expansion: APAC, North America, Europe, South America, and the Middle East and Africa.
Trends and Technological Advancements
Technological innovations remain a strong market trend, notably the growing preference for surface mount technology (SMT) over the traditional through-hole method and a surge in popularity of redistributed chip packaging. The market is also witnessing an increase in the adoption of flip-chip and System-in-Package (SiP) as well as lead-free packaging solutions, which are expected to boost the semiconductor packaging materials sector in the coming years.
Strategic Industry Analysis
The industry faces various challenges and opportunities, and the detailed analysis within this market review allows for strategic decision-making. The comprehensive nature of this review equips stakeholders with insights into competitive dynamics, pricing strategies, market forces, promotional nuances, and other critical industry factors. Key players in the sector are identified, providing a focused analysis of their market positions, and the potential impact of emerging trends and market challenges is being closely monitored to forecast growth opportunities.
Companies Featured

• Amkor Technology Inc.
• ASE Technology Holding Co. Ltd.
• BASF SE
• ChipMOS TECHNOLOGIES INC.
• DuPont de Nemours Inc.
• Henkel AG and Co. KGaA
• Heraeus Holding GmbH
• Hitachi Ltd.
• Honeywell International Inc.
• Indium Corp.
• Intel Corp.
• KYOCERA Corp.
• LG Innotek Co. Ltd.
• MITSUI and CO. LTD.
• Nan Ya Printed Circuit Board Corp.
• Nippon Steel Corp.
• Powertech Technology Inc.
• Samsung Electronics Co. Ltd.
• TAIWAN SEMICONDUCTOR CO. LTD.
• Texas Instruments Inc.

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