Japan’s PM Holds Talks with TSMC's Chief on Advanced Chip Production

(MENAFN) Japanese Prime Minister Sanae Takaichi convened Thursday with Taiwan Semiconductor Manufacturing Co. (TSMC) leadership in Tokyo as the chip giant advances preparations to mass-manufacture cutting-edge semiconductors on Japanese soil, local outlets reported.

The discussions centered on TSMC's blueprint to produce semiconductors utilizing 3-nanometer technology at its Kumamoto facility in southwestern Japan—a milestone that would represent the nation's inaugural production of chips at such an advanced scale, according to a Tokyo-based news agency.

Takaichi was anticipated to communicate her administration's backing for the initiative during the meeting, stressing its critical role in Japan's economic security framework, the report indicated.

TSMC Chief Executive Officer C.C. Wei is also slated to confer with Japan's Minister of Economy, Trade and Industry Ryosei Akazawa.

TSMC is presently developing a second semiconductor manufacturing site in Kumamoto Prefecture. The installation was originally designed to fabricate chips matching 6-nanometer technology specifications before undergoing strategic revisions.

The negotiations unfold against a backdrop of deteriorating China-Japan relations following November statements by Takaichi, when she characterized a hypothetical Chinese assault on Taiwan as potentially creating a "survival-threatening situation" for Japan, possibly justifying collective self-defense measures.

Beijing sharply condemned the remarks and subsequently cautioned Chinese nationals against journeying to Japan, while simultaneously reinstating prohibitions on Japanese seafood imports.

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