(MENAFN- GlobeNewsWire - Nasdaq) 3D IC Market growth is driven by demand for high-performance/low-power devices, AI/HPC workloads, IoT & miniaturization needs, advanced packaging (e.g. Through-Silicon Vias), and automotive electronics.

Austin, Oct. 15, 2025 (GLOBE NEWSWIRE) -- 3D IC Market Size & Growth Insights:

According to the SNS Insider,“The 3D IC Market S ize was worth USD 16.85 Billion in 2025E and is projected to reach USD 50.19 Billion by 2033, expanding at a CAGR of 14.64% over 2026-2033.”

Increasing Demand for High-Performance and Energy-Efficient Chips Across Different Applications to Boost Market Growth

The 3D IC market is driven by semiconductors that are quick, small, and power-efficient. AI, 5G, HPC, and smartphones are driving strong demand and growing adoption. Performance and Latency Optimization of TSVs and Hybrid Bonding As more data centers and driverless cars are installed, 3D IC penetration rises. The major players' massive R&D expenditures contribute to market expansion as well. Strong opportunities are presented by expanding use cases in AI accelerators, IoT, and autonomous cars. since improved connections in 5G networks depend on high-performance, small processors. Advanced computing applications perform better when the memory and logic layers are closer together.

The size of the U.S. 3D IC market was estimated at USD 4.75 billion in 2025E and is expected to expand at a compound annual growth rate (CAGR) of 14.33% from 2026 to 2033, reaching USD 13.86 billion.

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Leading Market Players with their Product Listed in this Report are:

• IBM
• ASE Technology Holding Co. Ltd.
• STMicroelectronics
• SAMSUNG
• Taiwan Semiconductor Co. Ltd.
• TOSHIBA CORPORATION
• Micron Technology Inc.
• MonolithIC 3D Inc.
• Intel Corporation
• TEZZARON
• Amkor Technology
• Jiangsu Changdian Technology Co. Ltd.
• United Microelectronics Corporation
• Advanced Micro Devices Inc.
• ANSYS Inc.
• Cadence Design Systems Inc.
• EV Group (EVG)
• SUSS MicroTec SE
• Siliconware Precision Industries Co. Ltd.
• Camtek

3D IC Market Report Scope:

Report Attributes	Details
Market Size in 2025E	USD 16.85 Billion
Market Size by 2033	USD 50.19 Billion
CAGR	CAGR of 14.64% From 2026 to 2033
Report Scope & Coverage	Market Size, Segments Analysis, Competitive Landscape, Regional Analysis, DROC & SWOT Analysis, Forecast Outlook
Key Segmentation	. By Product (Sensors, Memories, Logics, Light Emitting Diodes (LED) and Micro Electro Mechanical Systems (MEMS)) . By Application (Consumer Electronics, ICT/Telecommunication, Military, Automotive, Biomedical and Others) . By Component (Through Silicon Vias, Through Glass Vias, Silicon Interposer and Others) . By 3D Technology (Wafer Level Packaging and System Integration)

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Key Segmentation Analysis:

By 3D Technology

Wafer-level packaging is forecasted to account for the largest share at 68.23% in 2025 due to the trend of miniaturization, performance enhancement and cost saving in electronic applications. System integration will emerge as the fastest-growing technology with a CAGR of 14.79% due to the increasing demand for heterogeneous integration, improved computing performance and effective interconnect solutions for emerging applications such as AI, 5G and automotive electronics.

By Product

Sensors are expected to lead the 3D IC market in 2025 with an estimated share of 33.14% owing to their key role in allowing real-time data processing and offering convenient integration in smart phones, autonomous vehicles and IoT. Memories are projected to be the fastest-growing segment, recording a CAGR of 15.33% as growth in cloud computing, artificial intelligence and high-performance computing creates an urgency for storage and processing that is faster and more energy-efficient.

By Application

ICT/Telecommunication segment is anticipated to dominate the market with 34.65% share in 2025 fueled by the increase of high-speed networking, fast 5G up take and continued increase in data transport capacity. Consumer electronics will witness the fastest growth with a CAGR of 15.92% owing to the uptake of advanced smartphones, smart wearables, and gaming systems is on the rise, all of which will benefit from 3D ICs to achieve better performance, increased battery lifetime, and better user experience.

By Component

Through Silicon Vias (TSVs) segment is projected to hold the largest share at 46.32% in 2025 as it is known for offering better vertical interconnections, higher bandwidth, and lower power consumption. Through Glass Vias (TGVs) segment is expected to grow at the fastest CAGR of 15.16% due to their outstanding electrical properties and the ability to enable the next step in semiconductor packaging evolution.

Regional Insights:

In 2025E, North America dominated the 3D IC Market and accounted for 39.12% of revenue share. This leadership is driven by the R&D efforts in AI, HPC and cloud computing.

Asia Pacific is expected to witness the fastest growth in the 3D IC Market over 2026-2033, with a projected CAGR of 15.45% due to strong semiconductor manufacturing base in Taiwan, South Korea, and Japan.

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Recent News:

• In May 2025 , IBM and Deca Technologies entered an agreement to implement Deca's M-Series fan-out interposer (MFITTM) production at IBM's Bromont advanced packaging facility in North America.
• In February 2025 , ASE projected its advanced packaging and testing revenue to more than double to USD 1.6 billion, driven by surging global demand for AI chips.

Exclusive Sections of the 3D IC Market Report (The USPs):

• ADOPTION & PENETRATION RATES – helps you track the percentage of semiconductor companies adopting 3D IC packaging, penetration in AI chips, HPC, smartphones, and automotive applications, and adoption trends across consumer, industrial, and automotive markets.
• TECHNOLOGY TRENDS & SHARE – helps you analyze the distribution of 3D packaging types (3D stacked ICs, 2.5D ICs, 3D SoCs), market share by interconnect technology (TSVs, micro-bumps, hybrid bonding), heterogeneous integration adoption, and performance improvements in power, bandwidth, and footprint.
• PRODUCTION & MANUFACTURING STATISTICS – helps you evaluate average yield rates, wafer size distribution, defect density and cost-per-die trends, and installed capacity and utilization rates of leading 3D IC foundries.
• INVESTMENT & R&D DATA – helps you assess global R&D spending, patent activity in 3D IC technologies, venture capital funding for startups, and government/institutional grants supporting advanced research.
• MARKET GROWTH & DESIGN WIN TRENDS – helps you identify leading chipmakers' design wins using 3D IC technology and growth trends in key application segments, highlighting strategic opportunities.
• COMPETITIVE LANDSCAPE & INNOVATION BENCHMARKS – helps you gauge the competitive strength of top players, their market reach, product offerings, and recent technological developments, supporting strategic positioning and partnership decisions.

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