Teams at GITEX Global 2025 in Dubai will put liquid-cooled AI laptops under extreme thermal stress, testing whether advanced cooling systems can uphold sustained performance in one of the world's harshest climates. Omnix International's HOT Systems division, in partnership with PNY, will unveil a lineup of AI workstations, liquid-cooled laptops and the new HOT Guard monitoring suite, aiming to prove that these machines can maintain stability in high ambient temperatures.

At the heart of the exhibit is the challenge posed by regional heat: daytime temperatures in Dubai frequently exceed 40 °C, while indoor exhibition halls still pose cooling constraints. For high-performance AI workloads-particularly those involving CAD, BIM and machine learning-thermal throttling can cripple throughput. HOT Systems claims its integrated cooling and hardware optimisation can circumvent that performance drop. The accompanying HOT Guard software will monitor temperatures, fan and pump behaviour and security in real time on site.

Liquid cooling is no novelty in high-density server enclosures, but applying it in portable form factors presents a tougher engineering problem. In data centres, the shift from air to liquid systems has accelerated because conventional cooling struggles to keep up with power densities above 10–15 kW per rack. Liquid systems offer reduced power use, higher thermal headroom and often reclaimed waste heat reuse. But translating that to mobile form demands compact and robust fluid paths, efficient pumps, and risk control against leakage.

Advances in chip cooling are reinforcing that liquid systems represent more than a marginal improvement. Microsoft engineers have developed a microfluidics cooling technique that embeds coolant channels within the silicon substrate itself, enhancing heat removal efficiency at the chip level. That suggests future AI hardware may increasingly rely on liquid solutions at a micro scale.

Regional data centre operators are already embracing the shift: Khazna Data Centres, active across the UAE, has rolled out the country's first liquid-cooled AI data centre and is developing more AI-optimised campuses. The move reflects recognition that standard cooling infrastructure cannot scale profitably with AI workloads.

Technical design choices behind liquid cooling include direct-to-chip systems, which place cold plates atop CPUs or GPUs, and immersion cooling, where liquid envelops hardware. The former is more suited for modular, retrofit deployments; the latter can offer full heat removal but introduces maintenance and material challenges, especially for localised devices. A recent review in AI systems architecture emphasises single-phase direct cooling as a flexible compromise for power levels below extreme thresholds, though it demands high reliability in fluid delivery and sealing.

Within the exhibition context, the HOT Systems demo will likely emphasise sustained throughput rather than peak benchmarks. The company plans real-world workflows-such as rendering, simulation and AI model inference-to demonstrate how the cooling system maintains clock speeds under load. PNY's involvement underlines the reliance on qualified memory, GPUs and driver support, ensuring that thermal gains translate into usable computing stability.

End-users in architecture, media, engineering and AI fields are closely watching such developments. If heat throttling can be mitigated in this climate, portable AI rigs could expand in markets previously constrained to air-conditioned labs. But adoption depends on how well the solutions resist failure under harsh dust, vibration and heat cycles inherent to Gulf environments.

Arabian Post – Tech

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