(MENAFN- Straits Research) Introduction

The expansion of the global semiconductor assembly and packaging equipment market is driven by the rising demand for high-performance, compact electronics and the adoption of advanced technologies such as 5G and artificial intelligence, which require intricate packaging solutions like 3D/2.5D integration, HBM stacks, and chiplets.

Market Dynamics Requirements for AI and data center computing and memory stacking drive market growth

The demand for artificial intelligence is driving the necessity for more rapid and compact circuits, which is being addressed by packaging advancements such as HBM stacks and chiplet-based accelerators. These sophisticated packages necessitate specialised, high-precision apparatus to reduce delay.

• In February 2025, ASE Technology anticipates that revenue from advanced packaging and testing would exceed USD 1.6 billion, more than double due to robust demand for AI chip packaging.

As hyperscalers and IDMs demand increased memory bandwidth and chip stacking, OSATs enhance HBM and fine-pitch capacity, establishing a sustained requirement for sophisticated tools such as hybrid bonders and precise temperature control systems. A minor rise in the number of these high-value packages might result in a substantial increase in equipment expenditure, positioning AI as a crucial market driver.

Equipment and process bundles, along with "packaging-as-a-service" models create tremendous opportunities

To expedite the implementation of novel packaging technology, equipment vendors are combining their products with process recipes and on-site engineering assistance.

• In April 2025, Applied Materials purchased a 9% share in BE Semiconductor Industries (Besi) as a strategic investment to further their long-term collaboration on hybrid bonding technology for advanced semiconductor packaging.

The "packaging-as-a-service" strategy mitigates risk for clients and accelerates their time-to-yield. This strategy elevates tool pricing for vendors and establishes a continuous revenue stream from services and consumables. It mitigates ramp risk for customers and accelerates qualification, resulting in expedited adoption of sophisticated products.

Regional Analysis

The Asia Pacific region continues to be the preeminent area for assembly and packaging equipment. The region contains the largest concentration of OSATs, foundries, and downstream electronics production, collectively producing the most installed demand for both legacy and advanced packaging technologies. Taiwan's principal OSATs and suppliers are augmenting sophisticated packaging capacity to satisfy the demand for AI and mobile technologies, indicating robust regional demand for tooling and metrology. Furthermore, numerous advanced packaging developments are initially implemented in the Asia-Pacific region due to the proactive adoption by significant clients and foundries. Consequently, the absolute volumes of equipment and the demand for installed base services are strongest in the Asia-Pacific area, despite the acceleration of programs in other regions.

Key Highlights

• The global semiconductor bonding market size was estimated at USD 984.96 million in 2025 and is anticipated to grow from USD 1,060.86 million in 2026 to USD 1,410.17 million by 2034, growing at a CAGR of 4.1% from 2026 to 2034.
• By Technology, Hybrid or fine-pitch bonding is the leading technology subsegment, driven by the explosive demand for advanced packaging solutions in high-performance computing (HPC) and artificial intelligence (AI).
• By Equipment Type, the Hybrid / TCB Bonders and Aligners segment leads the market as it directly supports the advanced bonding technologies required for next-generation chips.
• By End Use, OSAT companies are the dominant end-use segment, driven by the industry's trend of outsourcing back-end processes to specialised providers.
• Based on region, the global market is segmented into North America, Europe, Asia Pacific, Latin America, and the Middle East and Africa. Asia Pacific dominates the global market.

Competitive Players

ASE

Amkor

JCET

Tongfu (TFME)

Besi (BE Semiconductor)

Kulicke & Soffa

ASMPT

Applied Materials

Tokyo Electron (TEL)

KLA

Lam Research

ASM International

Kulicke & Soffa (K&S)

TSMC

GlobalFoundries

SK hynix

Intel

Micron

Powertech (PTI)

Kaynes Technology

STMicroelectronics

Infineon

Intel

Recent Developments

• In April 2025 , Applied Materials announced it had acquired roughly 9% of BE Semiconductor Industries (Besi), a move that signals closer collaboration on hybrid and fine-pitch bonding toolchains and potential co-development.
• In January 2025 , GlobalFoundries announced the establishment of a first-of-its-kind Advanced Packaging and Photonics Centre at its Fab 8 campus in Malta, New York. The centre is intended to provide advanced packaging and test capabilities for U.S.-made chips used in AI, automotive, aerospace and defence.

Segmentation

By Technology

Wire bonding

Die-attach

Flip-chip bumping and reflow

Wafer-level packaging

Hybrid / fine-pitch bonding

Underfill and dispense systems

Sintering / transient liquid phase bonding

By Equipment Type

Wire bonders

Die-attach machines / pick-and-place bonders

Hybrid / TCB bonders and aligners

Bump deposition & reflow systems

Wafer handling / FO WLP tooling and panel handling

Inspection & metrology

Test handlers, burn-in and sorting equipment

By End Use

IDMs

OSAT

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