AGC Develops Quartz Lens for Deep Ultraviolet LEDs, Simplifying Manufacturing Processes and Reducing Capital Investment
Fig.1: Newly developed product
However, current deep ultraviolet LEDs (Fig.2) have some problems. One is about the transparent adhesive joining the lens and the window material. It is expensive and is easily degraded by ultraviolet light. The other problem concerns the current solder for joining the package and window. Clients must have large-scale deoxigination equipment at the time of hermetic sealing, and ultraviolet LED products have the risk of cracking and air leak because the current solder is so hard that thermal stress due to the difference of CTE between package and window directly attacks the interface of package and window.
Fig.2: Current productIn order to solve these problems, AGC Asahi Glass has newly developed quartz lens for deep ultraviolet LEDs (Fig.2). This product integrates the quartz window material and the lens with AGC's proprietary technology so that a transparent adhesive is not required. In addition, the "special solder" developed by AGC is already overlaid so that clients can join lens and cavity by simply heating and pressing in the atmosphere, without large-scale deoxigination equipment. Furthermore, the "special solder" is soft so as to ease the thermal stress due to the difference of CTE between package and window. So it will not crack or allow air leak. By these means, deep ultraviolet LED-manufacturing processes can be greatly simplified and capital investment can be reduced.
Photo:AGC will exhibit this product at the 47th NEPCON JAPAN Semiconductor and Sensor Packaging Technology Exhibition at Tokyo Big Sight, booth E27-47 in the East Hall 3, held from Wednesday, January 17, to Friday, January 19, 2018.
Under its "AGC plus" management policy, the AGC Group is committed to creating products that add "security, safety and comfort" to customers with "new value and functionality." AGC Asahi Glass will utilize the entirety of the electronic component technology it has cultivated over many years to provide high value-added products globally.(*1) Source: Fuji Chimera Research Institute LED-related market survey, 2017
Reference Exhibition Summary
1. Event: 47th NEPCON JAPAN Semiconductor and Sensor Packaging Technology Exhibition
2. Summary: Annual electronic-related manufacturing exhibition and event
3. Venue: Tokyo Big Sight (Japan)
4. Period: January 17 (Wed.) to January 19 (Fri.), 2018
5. Booth number: East Hall 3 E27-47
6. URL:
SOURCE AGC Asahi Glass
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