India, US Strengthen Tech Ties With Two Key Agreements At Indiasoft 2025

(MENAFN- KNN India) New Delhi, Mar 26 (KNN) At the 25th edition of IndiaSoft, two significant Memorandums of Understanding (MoUs) were signed to bolster collaboration between India and the United States in the electronics and ICT sectors.

These agreements aim to enhance India's electronics industry and improve international market access for domestic enterprises.

The first agreement, a Letter of Intent, was signed between the Electronics and Computer Software Export Promotion Council (ESC), the US India SME Council (USISME Council), and the Indiana Secretary of State.

This partnership focuses on strengthening business relations in the electronics and computer software sectors, particularly in Information and Communication Technologies (ICT).

The agreement outlines industry information sharing, business delegation exchanges, enterprise connections with state agencies, and joint organization of seminars and workshops. Advisory services will also be provided to guide businesses through market trends and growth opportunities.

The second agreement, signed by ESC Chairman Veer Sagar and ELCIA President V Sriram Kumar, is designed to foster the electronics industry ecosystem. This collaboration aims to support electronics manufacturers in expanding into global markets.

It will facilitate knowledge exchange through industry reports, mentorship programs for entrepreneurs, and participation in trade fairs, exhibitions, and buyer-seller meets both in India and abroad.

These strategic partnerships come at a crucial time when India's electronics and ICT industries are witnessing rapid growth, fueled by increasing digital adoption, government initiatives, and rising global demand for technology solutions.

The MoUs are expected to create new opportunities for businesses and contribute to India's vision of becoming a global technology leader.

(KNN Bureau)

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