(MENAFN- GlobeNewsWire - Nasdaq) With Level 2 to Level 4 systems requiring 30-1,000 TOPS of AI capability, the market faces unprecedented computational demands, especially as cooling and power efficiency become critical in electric vehicles. Key players like Nvidia, Qualcomm, Mobileye, and Horizon are leading with advanced systems-on-chips (SoCs), catering to various automotive levels and focusing on safety and efficiency upcoming report "Next-Generation Automotive Computing Market 2026-2036" examines these trends across ADAS, in-cabin monitoring, and connected vehicle technologies. It explores emerging markets, such as in-cabin monitoring systems driven by new regulatory mandates, and the shift to centralized computing in software-defined vehicles (SDVs).

Dublin, Nov. 19, 2025 (GLOBE NEWSWIRE) -- The "Next-Generation Automotive Computing Market 2026-2036: ADAS, AI In-Cabin Monitoring, Centralization, and Connected Vehicles" report has been added to offering.

Next-Generation Automotive Computing Market 2026-2036 provides an authoritative analysis of the next-generation automotive computing ecosystem, projecting market evolution from 2026 through 2036 across all major technology domains reshaping vehicle development. This report dissects the technological, regional, and competitive dynamics driving this transformation across Advanced Driver Assistance Systems (ADAS), autonomous driving (SAE Levels 0-5), in-cabin monitoring systems, software-defined vehicle architectures, and connected vehicle technologies.

The report delivers granular forecasts and strategic analysis across five critical market segments. ADAS and autonomous driving technologies receive comprehensive treatment spanning sensor suites (cameras, radar, LiDAR), perception and sensor fusion architectures, compute platforms requiring 30-1,000 TOPS (Tera Operations Per Second) depending on autonomy level, and regional deployment dynamics. Detailed analysis reveals China's acceleration toward Level 2 dominance with urban Navigation on Autopilot (NOA) systems, Europe's regulatory-driven ADAS adoption mandating features like Automatic Emergency Braking and Driver Monitoring Systems by 2024-2025, and North America's profitable but slower-growth trajectory focused on highway pilot applications.

The automotive computing market stands at an inflection point, transforming from traditional embedded controllers into sophisticated AI-powered platforms rivaling datacenter infrastructure. This evolution, driven by autonomous driving's computational demands and software-defined vehicle architectures, represents one of the semiconductor industry's fastest-growing segments.

In-cabin monitoring systems constitute a rapidly emerging market by 2030, driven by regulatory mandates (EU General Safety Regulation, China GB standards) and autonomous driving requirements. The report analyzes Driver Monitoring Systems (DMS) and Occupant Monitoring Systems (OMS) technology evolution from legacy steering torque sensors to advanced AI-powered camera and radar solutions delivering gaze tracking, drowsiness detection, and comprehensive cabin safety monitoring. Market forecasts cover NIR cameras, visible light systems, ToF sensors, radar-based monitoring, and emerging multi-modal approaches across all autonomy levels.

Software-Defined Vehicle (SDV) architectures represent the fundamental restructuring of automotive electrical/electronic systems, transitioning from 100 distributed ECUs to centralized zone-based computing. The report's SDV maturity model (Levels 0-4) benchmarks major OEMs including Tesla, BYD, XPeng, Nio, Mercedes-Benz, BMW, and Volkswagen against architectural evolution criteria: computing centralization, over-the-air update capabilities, service-oriented architectures, and feature monetization strategies. Market sizing covers central compute platforms, zone controllers, automotive Ethernet infrastructure, hypervisors, containerization, and connected services generating $30-50 billion annual recurring revenue by 2035.

LiDAR, radar, and camera technologies receive detailed technical and market analysis, including 4D imaging radar emergence, solid-state LiDAR cost trajectories (targeting $200-500 by 2027-2030), and sensor fusion architectures. The report identifies Chinese LiDAR manufacturers (Hesai, RoboSense, Livox, Seyond) capturing 60% global market share through aggressive pricing and domestic OEM partnerships. Connected vehicle and V2X technologies forecasts track C-V2X chipset adoption, infrastructure deployment across China's 28,000 roadside units, and autonomous vehicle coordination applications.

Nvidia dominates high-performance autonomous computing with its Drive platform, supplying Mercedes, Volvo, Lucid, and numerous Chinese OEMs. The Orin SoC (254 TOPS) captures the L2 /L3 market, while the forthcoming Thor (2,000 TOPS, 2025-2026 production) targets Level 4 applications. Nvidia's competitive moat combines hardware performance with comprehensive software stacks - CUDA compatibility, simulation tools (Omniverse), and perception libraries enabling rapid customer development.

Qualcomm challenges Nvidia in mid-tier segments with Snapdragon Ride platforms. The SA8295P (30 TOPS) wins design sockets in BMW, GM, Stellantis, and Renault vehicles, leveraging Qualcomm's automotive connectivity expertise (integrating 5G modems, V2X, WiFi) into unified platforms. Qualcomm's strategy emphasizes cost-effectiveness and power efficiency over absolute performance, positioning for mass-market L2/L2 deployments where Nvidia's premium pricing proves prohibitive.

Mobileye (Intel) pursues vertical integration, bundling EyeQ SoCs with proprietary perception software and REM crowdsourced mapping. The EyeQ6 (34 TOPS) and upcoming EyeQ Ultra (176 TOPS) target L2 through L3 systems, with 40 OEM partnerships including Volkswagen, Nissan, and Geely. Mobileye's installed base exceeds 100 million vehicles, providing data advantages for AI training and map generation, though closed ecosystem alienates OEMs seeking flexible software development.

Regional dynamics reshape competition. Chinese players capture domestic market share amid U.S. export restrictions on advanced AI chips. Horizon's Journey 5 (96 TOPS) powers XPeng, Li Auto, and SAIC vehicles, while geopolitical considerations drive Chinese OEMs toward indigenous compute solutions. This balkanization threatens industry consolidation, potentially creating incompatible regional ecosystems. Tesla's custom FSD Computer exemplifies vertical integration's extreme - proprietary neural network accelerators optimized specifically for Tesla's perception algorithms, manufactured by Samsung on 7nm process nodes. While serving only Tesla vehicles, the approach demonstrates performance and cost advantages from co-designing hardware and software, influencing OEM strategies toward custom silicon (GM's Cruise chips, Mercedes partnerships with Nvidia for semi-custom designs).

Report Contents include:

Technology Analysis:

• SAE Level 0-5 autonomous driving systems with 20-year deployment forecasts
• Multi-sensor fusion architectures: early, late, and mid-level fusion strategies
• ADAS processor market sizing: front cameras, central computing, radar/LiDAR processing
• LiDAR technology comparison: MEMS, solid-state flash, FMCW systems
• 4D imaging radar capabilities vs. traditional radar and LiDAR
• In-cabin sensing: DMS/OMS hardware and AI software evolution
• End-to-end neural network architectures vs. modular pipelines
• Software-defined vehicle maturity models and OEM benchmarking

Market Forecasts (2024-2036):

• Global vehicle sales by SAE automation level
• ADAS feature adoption by region: ACC, LKA, AEB, automated parking
• Sensor volumes and revenues: cameras, radar, LiDAR, ultrasonics
• Automotive processor shipments and wafer production requirements
• In-cabin monitoring system penetration and technology mix
• LiDAR-equipped vehicle forecasts for passenger cars and robotaxis
• Connected vehicle and V2X chipset markets
• Central compute platform and zone controller revenues
• OTA software update and subscription service markets

Regional Market Analysis:

• United States: state-by-state L2 /L3 adoption patterns, regulatory landscape
• China: tier-city penetration forecasts, domestic vs. foreign OEM strategies
• Europe: EU General Safety Regulation impact, Euro NCAP protocol evolution
• Japan: market challenges, non-Japanese brand penetration, aging demographics

Competitive Landscape:

• 300 company profiles across OEMs, Tier-1 suppliers, semiconductor vendors, software providers
• OEM ADAS strategies
• Tier-1 supplier analysis
• Computing platforms
• LiDAR suppliers: Chinese dominance vs. Western players
• Software-defined vehicle leaders: architecture evolution, middleware, OTA platforms

Strategic Business Intelligence:

• Liability frameworks across autonomy levels by jurisdiction
• ADAS subscription and feature-on-demand business models
• Fleet learning and data monetization strategies
• V2X deployment challenges and funding mechanisms
• Autonomous vehicle coordination technologies
• Generative AI applications: in-vehicle assistants, design workflows, digital twins
• SDV feature monetization: subscriptions, unlocks, data services, in-vehicle commerce

Companies Featured

• 5GAA
• 7invensu
• Acconeer
• Actronika
• ADASTEC
• Aeva
• AEye
• AiDEN
• Aidin Robotics
• AION
• Aisin
• Aito
• Algolux
• Alibaba Group
• Allwinner Technology
• Alphabet
• Alps Alpine
• Amazon
• Ambarella
• AMD
• Amf
• ams OSRAM
• Analog Photonics
• Apollo
• Apple
• Aptiv
• Arbe
• Arcfox
• Argo
• ARM
• Arriver
• Artosyn
• Aryballe
• Athos Silicon
• Audi
• Aumovio
• AUO
• Aurora
• AutoChips
• Autocrypt
• Autotalks
• Autox
• Avatr
• AWS
• Baidu
• Baraja
• Beijing Morelite Semiconductor
• Beijing Surestar Technology
• Black Sesame Technologies
• Blaize
• Blickfeld
• BMW
• BOS
• Bosch
• Broadcom
• BYD
• Cambricon
• CardioID
• Cariad
• CEA Liten
• Celestica
• Cepton Technologies
• Chery
• Cipia
• Cohda Wireless
• Coherent
• Commsignia
• Continental
• Cruise
• Daimler
• DeepMap
• Delphi
• Dena
• Denso
• Desay SV
• Didi
• DJI
• Dongfeng Lantu Automobile
• EasyMile
• EcarX
• Eckhardt Optics
• Efinix
• Emotion3D
• Epicnpoc
• Ethernovia
• Excelitas Technologies
• Eyeris
• Fabrinet
• Faurecia
• FCA
• Five
• ForcIOT
• Ford
• Foxconn
• Fujitsu
• Geely
• General Motors
• Geo Semiconductor
• Google
• Great Wall
• Guangshao Technology
• Hailo
• Halo
• Hamamatsu Photonics
• Harman
• HAVAL
• Hella
• Hesai
• HiRain
• HiSilicon
• Hitronics Technologies
• Honda
• Hongoi
• Hongqi Auto
• Horizon Robotics
• Huawei
• Human Design Group
• Hypersen Technologies
• Hyundai Mobis
• IM Motors
• Imagination Technologies
• Infineon
• InnovationLab
• Innoviz Technologies
• Intel
• Iridian Spectral Technologies
• Jabil
• Jaguar
• Jetour
• Joyson Safety Systems
• Jungo Connectivity
• Kalray
• Kneron
• Koito
• Kyocera
• Laser Components
• Lattice Semiconductor
• Leapmotor
• LeddarTech
• LeiShen Intelligent System
• Leonardo
• Lexus
• LG
• LG Innotek
• Li Auto
• Lidwave
• Livox
• Lotus
• Lumentum
• Lumibird
• Luminar
• Lumotive
• Luxeed
• Lyft
• Magna
• Mahindra
• Marelli
• Marvell
• MAXUS
• Mediatek
• Melexis
• Meller Optics
• Mercedes-Benz
• Micro Photon Devices
• Microchip
• Microsoft
• MIPS
• Mitsubishi Electric
• Mobileye
• Momenta
• Monumo
• Morningcore
• Motional
• Movento
• Murata
• Myant
• NavInfo
• Navtech
• Navya
• Next2U
• Nextcore
• Nikon
• NIO
• Nissan
• Nuance
• NVIDIA
• NXP
• OEwaves
• Ommatidia LiDAR
• OmniVision
• ON Semiconductor
• OpenAI
• Ophir
• Oplatek
• Oppo
• OQmented
• Ottopia
• Ouster
• Panasonic
• Phantom Auto
• PIX Moving
• Pointcloud
• Polestar
• Pontosense
• Pony
• PreAct Technologies
• Preciseley Microtechnology
• Prophesee
• PSA
• PSSI
• Qcraft
• Quadric
• Qualcomm
• Quantel Laser
• Quantum Semiconductor International (QSI)
• Quectel
• Recogni
• Renault Nissan
• Renesas
• Rivian
• Robosense
• Rockchip
• Rolling Wireless
• SAIC-GM-Wuling Automobile
• Samsung
• Sanmina
• SaverOne
• Scantinel Photonics
• Seeing Machines
• SemiDrive
• Seminex
• Senseair
• SenseTime
• Seres Automotive
• Seyond
• Siengine
• SiLC Technologies
• SiMa
• Singgo
• Skywater
• Smart Eye
• Softkinetic
• Sony
• Steerlight
• Stellantis
• STMicroelectronics
• Subaru
• Tacterion
• TCL Technology
• Telechips
• Teledyne FLIR
• Teraxion
• Tesla
• Texas Instruments
• Thorlabs
• Tobii
• Toshiba
• Toyota
• TriEye
• TriLumina (Lumentum)
• Trumpchi
• TSMC
• Uhnder
• Ultraleap
• Unikie
• UNISOC
• Unity
• Untether AI
• Valeo
• Vayyar
• Veoneer
• VeriSilicon
• Videantis
• Visionox
• Visteon
• Volkswagen
• Volvo
• Voyant Photonics
• Vsora
• WaveSense
• Waymo
• Webasto
• WeRide
• WEY
• WHST
• Wideye
• Woven Planet
• XenomatiX
• XFAB
• Xiaomi
• Xilinx
• XPeng
• Xperi
• Zeekr
• Zelostech
• Zenseact
• ZF Friedrichshafen
• Zoox
• ZTE

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