Panel Level Packaging Market By Key Players, Deployment Type, Applications, Vertical, and Region

(MENAFN- Comserve) Shibuya-ku, Tokyo, Japan, Japan, Oct 12, 2021, 06:49 /Comserve / -- Panel Level Packaging Market With Top Countries Data, Industry Analysis , Size, Share, Revenue, Prominent Players, Developing Technologies, Tendencies and Forecast

The panel level packaging (PLP) market is anticipated to register a CAGR of 28.0% over the forecast period from 2020 to 2025. Panel Level Packaging (PLP) has been expected to become a critical packaging process. Manufacturers are increasingly driving their suppliers to provide panel -processing tools and materials to allow them to bring wafer-level precision to packaged processed on panel substrates. This packaging is used in the packaging of field-programmable gate array (FPGA), CPU/GPU, power management IC module, baseband, and others. The solution provides to reduce the cost of circuit packaging and enhances design flexibility.

- The latest trend in the packaging is Fan-out packaging, which is the promising area of market advancement in the global semiconductor packaging industry. Players such as ASE, Powertech, Nepes, and Samsung are looking forward to panel -level packaging, providing economies of scale. These companies are developing or ramping up panel-level fan-out packaging to reduce the cost of advanced packaging. Wafer-level fan-out is one of the several advanced packaging types where packages can incorporate dies, MEMS, and passives in a single IC package. This approach has been in production for many years and is produced in a round wafer format in 200mm or 300mm wafer sizes.
- Players such as Mi Technovation Bhd are primarily involved in the design, manufacturing, and sale of the wafer level chip scale package and sorting machines with the inspection and testing capabilities for the semiconductor industry. 

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Key Market Trends

Consumer Electronics is Expected to Hold Major Share

- Mobile consumer electronics are powering a new wave of developments in electronic packaging. In the United States, with increasing consumer electronic sales year on year, the demand for panel-level packaging significantly rises. Further, Berlin's Fraunhofer IZM is the place to be for leading industry players wishing in developing the fundamental processes for the new panel-level packaging and creates viable first demonstrators on large-scale organic substrate formats in the consumer electronics. After the successful venture for two years, the consortium is focused on embracing new members with new research avenues.
- Moreover, at the start of 2020, TSMC was investing heavily in 5nm fabrication. TSMC's 7nm process is at its peak, receiving vast numbers of orders from AMD for its Ryzen 3000-series CPUs and Navi graphics cards and other customers, including Apple and Huawei. On the 5nm front, TSMC is working with EUV lithography, similar to what Samsung is accomplishing, and the company expects 10% of 2020's year's revenue to come from its 5nm EUV lines. After the 3nm process takes over, TSMC expects mass production to start in 2022. This significantly drives the market in the future period.
- Also recently, SEMCO achieved a new milestone by rolling out APE-PMIC devices with FO (Fan-Out) embedded panel-level packaging (ePLP) PoP technology for Samsung Galaxy Watch. SEMCO announced to continue to innovate for a cost-effective HDFO market space to compete with TSMC for Apple's packaging and FE business again. In years to come, SEMCO's HDFO is anticipated to be utilized first in Samsung's cellphones. Besides, a restructure between SEMCO, and Samsung Electronics could be favorable for Samsung's position as the full turnkey provider for a FE+BE bundle.

North America is Expected to Hold Significant Share

- North America is expected to reflect significant growth in the market due to the high adoption of consumer electronics, advanced technology integration in the automotive, and further with various players who focused on investing in the region. The researchers in the region are extensively investing in product innovations using MEMS. California-based MEMS Drive announced to partner with SmartSens Technology to integrate MEMS with image sensing chips for achieving chip-level optical image stabilization (OIS) to extend its application in security monitoring, AI, ML, and autonomous vehicles. This significantly drives the packaging in MEMS for the hermetically sealed and reliable packaging solutions.

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- The United States leads the world in manufacturing, designing, and researching concerning the semiconductor industry. The country is also the frontrunner in semiconductor packaging innovation, boasting of 80 wafer fabrication plants spreading across its 19 states. Further, in March 2020, Taiwan Semiconductor Manufacturing Co, has joined forces with US-based IC design house Broadcom Inc. to develop the advanced 5 nanometers (nm) process. TSMC announced it has teamed up with Broadcom to bolster its chip-on-wafer-on-substrate (CoWoS) IC packaging platform that supports 5nm technology.

Competitive Landscape

As few players are dominating the market with their technological expertise in level packaging technology, the global market for panel level packaging is expected to be consolidated in nature. Amkor Technology, Inc., Deca Technologies, Lam Research Corporation, ASE Group, and Taiwan Semiconductor Manufacturing Company Limited are some of the major players in the current market. However, giant chip manufacturers such as Intel Corporation, Qualcomm Technologies, Inc., are involved in extensive R & D and market development activities to develop competitive panel level packaging technology in the coming years.

1 INTRODUCTION
1.1 Study Assumptions and Market Definition
1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET DYNAMICS
4.1 Market Overview (Assessment with COVID-19 Impact)
4.2 Introduction to Market Drivers and Restraints
4.3 Market Drivers
4.3.1 Reduced Cost of Packaging Process
4.3.2 Enhanced Design Flexibility and Physical Performance of Chips
4.3.3 Increased Investment on Research & Development Activities
4.4 Market Restraints
4.4.1 Complexity in Packaging Process
4.5 Industry Value Chain Analysis
4.6 Industry Attractiveness - Porter's Five Force Analysis
4.6.1 Threat of New Entrants
4.6.2 Bargaining Power of Consumers
4.6.3 Bargaining Power of Suppliers
4.6.4 Threat of Substitute Products
4.6.5 Intensity of Competitive Rivalry

5 MARKET SEGMENTATION

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