(MENAFN- GlobeNewsWire - Nasdaq) Flip chip technology offers substantial market opportunities by enhancing performance, reducing form factors, and increasing design flexibility. Key growth areas include data centers, automotive, and healthcare sectors, with strong innovation hubs in Asia-Pacific. Companies prioritizing sustainable practices and supply chain resilience will excel.

Dublin, Sept. 15, 2025 (GLOBE NEWSWIRE) -- The "Flip Chip Technology Market - Global Forecast to 2030" report has been added to ResearchAndMarkets's offering.

The Flip Chip Technology Market grew from USD 32.98 billion in 2024 to USD 35.36 billion in 2025. It is expected to continue growing at a CAGR of 7.08%, reaching USD 49.73 billion by 2030.

Flip chip technology is rapidly reshaping the global semiconductor landscape as original equipment manufacturers and service providers prioritize enhanced performance, miniaturization, and efficient system integration. As supply chains become more complex and innovation cycles shorten, decision-makers increasingly view advanced packaging solutions as a strategic lever for market differentiation and operational resilience.

This steady expansion is driven by the fast-adoption of flip chip solutions across data centers, next-generation mobile platforms, automotive, and healthcare segments. As a critical enabling technology within the semiconductor value chain, flip chip addresses stringent requirements for high-speed connectivity, reduced power consumption, and minimal form factors, all while maintaining thermal and electrical reliability across diverse end-market environments.

With accelerated adoption and evolving innovation cycles, flip chip technology is central to next-generation product architectures. Market participants who invest in adaptability, collaboration, and sustainability will be best positioned for long-term competitiveness in the global semiconductor ecosystem.

Key Takeaways: Strategic Insights for the Flip Chip Technology Market

• Rising performance demands and space constraints are accelerating transition from wire bond to flip chip interconnects, particularly in servers, GPUs, and high-density memory modules.
• Expansion of fan out and panel-level assembly enables greater design flexibility, allowing companies to optimize form factors and cost structures simultaneously.
• Increased collaboration among foundries, substrate fabricators, and outsourced assembly providers ensures advanced manufacturing readiness and mitigates supply interruptions.
• Sustainability factors are actively shaping vendor selection, evidenced by growing adoption of eco-design principles and reduced material waste in production.
• Regional hubs, especially in Asia-Pacific, play a pivotal role in technology transfers, scale efficiencies, and investment in packaging innovation centers, positioning the region as a leader in advanced flip chip adoption.

Key Attributes:

Report Attribute	Details
No. of Pages	187
Forecast Period	2025 - 2030
Estimated Market Value (USD) in 2025	$35.36 Billion
Forecasted Market Value (USD) by 2030	$49.73 Billion
Compound Annual Growth Rate	7.0%
Regions Covered	Global

Market Dynamics

• Accelerating integration of fan-out wafer-level packaging to meet high-bandwidth 5G and AI chip demands
• Rising deployment of copper pillar and micro-bump interconnects to support heterogeneous system integration
• Emergence of sintered silver as an alternative under-bump metallization for improved thermal reliability
• Advancements in substrate engineering to enable ultra-fine pitch flip chip assemblies for high-density applications
• Growing focus on sustainable and low-CO2 underfill materials to address environmental regulations and supply chain pressures
• Increasing use of thermal interface materials with nano-enhanced fillers to optimize heat dissipation in high-power devices

Market Insights

• Porter's Five Forces Analysis
• PESTLE Analysis

Scope & Segmentation: Market Depth, Regions, and Technology Drivers

• Applications: Servers, data centers (CPU, GPU, memory, networking), smartphones (5G, LTE), tablets and PCs (desktop, laptop, tablet)
• End User Industries: Automotive (ADAS, infotainment), communication (networking equipment, telecom infrastructure), consumer electronics (audio visual, home appliances), healthcare (medical imaging, wearables)
• Packaging Technologies: Fan in (FC BGA, FC CSP), fan out (EWLB, FO WLP)
• Bump Materials: Copper pillar (micro pillar, standard pillar), solder bump (lead free, tin silver)
• Wafer Sizes: 200 mm, 300 mm
• Assembly Types: Die level (chip level, chip on board), panel level (MLP, RDL)

Competitive Landscape

• Market Share Analysis, 2024
• FPNV Positioning Matrix, 2024

Competitive Analysis

• ASE Technology Holding Co., Ltd.
• Amkor Technology, Inc.
• JCET Group Co., Ltd.
• Powertech Technology Inc.
• Unisem (Malaysia) Berhad
• UTAC Holdings PLC
• Hana Micron Inc.
• King Yuan Electronics Co., Ltd.
• TongFu Microelectronics Co., Ltd.
• Chipbond Technology Corporation

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Attachment

• Flip Chip Technology Market

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