Integrated Passive Devices (IPD) Market Size, Recent Trends, Competitors Strategy, Regional Analysis and Industry Growth by Forecast to 2022

(MENAFNEditorial) Integrated Passive Devices Market, By Material (Silicon Base, Non-Silicon Base), By Products (Couplers, Diodes, Diplexers), By Application (RF Power Amplifier, Smartphones, Wi-Fi Devices, GPS, RF Transceivers) - Forecast 2022

Market Highlights:

Market Research Future published a Half-Cooked research report on 'Global Integrated Passive Devices Market Research Report - Forecast to 2022 Market Analysis, Scope, Stake, Progress, Trends and Forecast to 2022

On Semiconductor (U.S.), Infineon Technologies AG (Germany), Texas Instruments Inc. (U.S.), STMicroelectronics (U.S.), Micron Technology, Inc. (U.S.), STATS ChipPAC Ltd (Singapore), Global Communication Semiconductors, Inc. (U.S.), Global Communication Semiconductors, LLC (U.S.), 3DiS Technologies (France), OnChip Devices, Inc. (U.S.), Johanson Technology, Inc. (U.S.) are some of the prominent players at the forefront of competition in the Global Integrated Passive Devices Market and are profiled in MRFR Analysis.

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Major Key Players

• On Semiconductor (U.S.),
• Infineon Technologies AG (Germany),
• Texas Instruments Inc. (U.S.),
• STMicroelectronics (U.S.),
• Micron Technology, Inc. (U.S.),
• STATS ChipPAC Ltd (Singapore),
• Global Communication Semiconductors, Inc. (U.S.),
• Global Communication Semiconductors, LLC (U.S.),
• 3DiS Technologies (France),
• OnChip Devices, Inc. (U.S.),
• Johanson Technology, Inc. (U.S.)

are some of the prominent players at the forefront of competition in the Global Integrated Passive Devices Market and are profiled in MRFR Analysis.

Industry News

January 19, 2018- As the preferred solution for semiconductor reference designs, Johnson Technology has joined Sigfox's preferred partner network as an antenna and RF-front end solutions provider. Theirs embedded ceramic antenna and design services for small-cell IoT environment makes it a great fit for this cooperative effort.

May 11, 2016 - STATS ChipPAC Pte. Ltd., a leading provider of advanced semiconductor packaging and test services, announced that it has shipped over one billion fan-out wafer level packages (FOWLP), also known in the industry as embedded Wafer Level Ball Grid Array (eWLB). FOWLP or eWLB is an advanced packaging technology platform that provides ultra-high density interconnection, superior electrical performance and the ability to integrate multiple heterogeneous dies in a cost effective, low-profile semiconductor package.

Industry Overview

Integrated Passive Device or IPD's is a growing technology which offers ideal trade-off for system in package integration. Passive devices are essential parts of Systemin-Package (SiP) solutions and today, it is getting used in various functions in semiconductor industry including- s decoupling, biasing, resonating, filtering, matching and transforming among others. As, the new technologies are coming into picture and demand for the small, lightweight products are increasing, it is also driving the market of integrated passive devices. Integration of passive devices on the silicon wafers, companies are achieving new levels and becoming capable of producing IPDs which are significantly smaller, thinner and higher performance than the standard discrete passive devices. According to a recent study report published by the Market Research Future, The global market of Integrated Passive Devices Market is booming and expected to gain prominence over the forecast period. The market is projected to demonstrate a spectacular growth by 2022, surpassing its previous growth records in terms of value with a striking CAGR during the anticipated period (2016 2022).

The aspects such as growing adoption of integrated passive devices in consumer electronics and the implementation of integrated passive devices in RF applications are the major driving factors for this market. However, factors such as high cost of integrated passive devices compared to discrete components is hampering the market growth. Further, the RF tuning of integrated passive devices demands longer product design cycle, which acts as a major restraining factor for the market.

Segmentation

The Integrated Passive Devices Market can be classified into 5 key segments for the convenience of the report and enhanced understanding;

Segmentation by Base: Comprises silicon and non-silicon.

Segmentation by Product: Comprises Baluns and Couplers, Harmonic Filters, Diplexers, others (Triplexers, ESD Diodes, and Customized IPDs).

Segmentation by Type: Comprises ESD, EMI, RF-IPD and Others (LEDs.

Segmentation by Application: Comprises EMI/RFI Filtering, LED Lighting Data Converters

Segmentation by Regions: Comprises Geographical regions - North America, Europe, APAC and Rest of the World.

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Intended Audience:

• Semiconductor Manufacturing companies
• Semiconductor Suppliers
• Integrated device manufacturers
• Research Institutes
• Government

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