Huawei's AI Chip Plan Designed To Break US Dependence
On September 18, Huawei chairman Eric Xu announced a three-year roadmap for the company's Ascend series of processors at the Huawei Connect 2025 conference in Shanghai.
Coming soon after the Chinese government decided to block Chinese companies from using Nvidia processors , Huawei's announcement will heighten competition between Chinese and American AI efforts while signaling a significant reduction in China's dependence on American technology.
Explaining the roadmap, Xu told the audience that, following the launch of the Ascend 910C earlier this year, Huawei will release three new chip series – the Ascend 950, 960, and 970 – in 2026, 2027, and 2028, respectively.
“Generally, we will follow a one-year release cycle and double compute with each release,” he said. That pace of development, if achieved, is comparable to that of leading US chipmakers Nvidia and AMD.
Xu also said Huawei will offer proprietary high-bandwidth memory (HBM) solutions for variants of the Ascend 950, revealing that, along with Chinese memory maker CXMT, Huawei has been working hard to escape dependence on HBM imported from Korea – a target of US sanctions.
Xu's keynote address, titled“Groundbreaking SuperPoD Interconnect: Leading a New Paradigm for AI Infrastructure,” outlined Huawei's plans“to create a new computing architecture, and develop computing SuperPoDs and SuperClusters, to sustainably meet long-term demand for computing power.”

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