(MENAFN- PR Newswire) Galitzky most recently served as Vice President, Surface Devices and Accessories at Microsoft, where he helped define Microsoft's edge AI roadmap for consumer devices and its integration into mainstream computing platforms, including the Surface Copilot+ PC portfolio. Earlier, he played pivotal roles in developing Xbox One, Kinect, and a range of Surface devices and accessories. Prior to his 17 years at Microsoft, he spent more than a decade at IBM leading advanced chip design programs.

"Yaron's track record in advancing AI-driven design speaks volumes. From pioneering Xbox and Kinect to shaping Surface Copilot+ PCs at Microsoft, he has consistently transformed emerging technologies into globally recognized innovations," said Amir Panush, CEO of Ceva. "His decision to join Ceva underscores our commitment to leading the next wave of AI at the edge including innovations in physical AI that bring intelligence closer to the real world. With his proven ability to build world-class teams and deliver products from silicon to complete systems, Yaron's leadership will accelerate our mission to make the Smart Edge more intelligent, inclusive, and impactful."

"We're entering a new era where AI will transform every connected device," said Yaron Galitzky, Executive Vice President, AI Division at Ceva. "Ceva is uniquely positioned to lead this transformation with its bold vision, exceptional talent, and innovative culture. I'm truly inspired by this foundation and see tremendous potential in Ceva's unique IP and ecosystem to redefine how AI is architected, deployed, and scaled. I'm energized and grateful for the opportunity to join this outstanding team and help drive breakthrough innovation and business growth at the critical intersection of AI and silicon."

About Ceva, Inc.
At Ceva, we are passionate about bringing new levels of innovation to the smart edge . Our wireless communications , sensing and Edge AI technologies are at the heart of some of today's most advanced smart edge products. From Bluetooth , Wi-Fi , UWB and 5G platform IP for ubiquitous, robust communications, to scalable Edge AI NPU IP s, sensor fusion processors and embedded application software that make devices smarter, we have the broadest portfolio of IP to connect, sense and infer data more reliably and efficiently. We deliver differentiated solutions that combine outstanding performance at ultra-low power within a very small silicon footprint. Our goal is simple – to deliver the silicon and software IP to enable a smarter, safer, and more interconnected world. This philosophy is in practice today, with Ceva powering more than 20 billion of the world's most innovative smart edge products from AI-infused smartwatches, IoT devices and wearables to autonomous vehicles and 5G mobile networks.

Our headquarters are in Rockville, Maryland with a global customer base supported by operations worldwide. Our employees are among the leading experts in their areas of specialty, consistently solving the most complex design challenges, enabling our customers to bring innovative smart edge products to market.

Ceva: Powering the Smart EdgeTM

Visit us at and follow us on LinkedIn , X , YouTube , Facebook, and Instagram .

SOURCE Ceva, Inc.

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