China Semiconductor Device Market (2026-2031) - Growth Driven By Rising Electric Vehicle And 5G Technology Demand
Dublin, Sept. 16, 2026 (GLOBE NEWSWIRE) -- "China Semiconductor Device - Market Share Analysis, Industry Trends & Statistics, Growth Forecasts (2026-2031)" has been added to ResearchAndMarkets.com's offering.
China Semiconductor Device Market to Reach USD 332.17 Billion by 2031, Driven by AI, 5G and Domestic Manufacturing
The China semiconductor device market was valued at USD 217.55 billion in 2025 and is projected to increase from USD 233.46 billion in 2026 to USD 332.17 billion by 2031. The market is expected to register a compound annual growth rate of 7.31% during the 2026-2031 forecast period, supported by domestic capacity expansion, artificial intelligence infrastructure investment, 5G deployment and rising semiconductor demand from automotive and industrial applications.
Domestic Semiconductor Capacity Expansion Accelerates
China expanded semiconductor foundry capacity by 15% in 2024 and is scheduled to add another 14% in 2025. Major domestic manufacturers, including SMIC, Hua Hong and Nexchip, are increasing mature-node production capacity to address demand across consumer electronics, industrial systems and automotive applications.
Localization efforts are also extending beyond wafer fabrication into semiconductor materials and equipment. Domestic suppliers have achieved higher adoption rates in areas such as photoresist stripping and wet-clean processing tools. By 2027, China is projected to represent 31% of global 28-nanometer semiconductor capacity, potentially influencing global supply and pricing across mature process nodes.
Continued progress will depend on reliable power supplies, access to process-engineering talent and the availability of alternative equipment sources that reduce exposure to international trade restrictions. These investments are expected to strengthen China's semiconductor supply chain while improving utilization rates and operating performance throughout the domestic ecosystem.
AI and Edge Computing Create New Semiconductor Demand
Investment by China's leading cloud service providers is emerging as a significant market growth catalyst. Alibaba has pledged CNY 380 billion, equivalent to approximately USD 52.9 billion, for AI-ready cloud infrastructure between 2025 and 2027. Tencent and Baidu have also announced substantial investment programs targeting artificial intelligence and advanced computing capacity.
These initiatives are increasing demand for graphics processors, high-bandwidth memory, network switch application-specific integrated circuits and domestically designed system-on-chip products. The expansion of edge AI is further encouraging low-latency, on-premises computing infrastructure that complies with national data-sovereignty requirements. Alignment between cloud capital expenditure, domestic chip design and local fabrication is expected to support China semiconductor market growth over the medium term.
Export Controls Continue to Restrict Advanced-Node Development
Export-control measures introduced by the United States in October and December 2024 restrict shipments of extreme ultraviolet lithography systems, advanced deposition equipment and high-end electronic design automation licenses to Chinese semiconductor manufacturers. These restrictions continue to limit high-volume domestic production at advanced process nodes.
Chinese manufacturers are pursuing alternatives such as deep ultraviolet multiple-patterning and experimental transistor architectures. However, longer equipment lead times, software licensing uncertainty, compliance requirements and yield challenges may slow the transition to advanced-node commercial manufacturing.
Integrated Circuits Maintain Market Leadership
Integrated circuits accounted for 86.02% of China semiconductor device market revenue in 2025. The segment is forecast to expand at a CAGR of 8.02% through 2031, adding more than USD 69.2 billion in output. Growth is being supported by AI systems, 5G infrastructure, servers, advanced memory and larger semiconductor die requirements.
Momentum is evident across China's memory and foundry sectors. YMTC has advanced its 232-layer 3D NAND technology, while CXMT has reported progress in DDR5 production yields. SMIC's 12-inch fabrication lines have operated at 89.6% utilization amid sustained demand from consumer and industrial customers.
Discrete power semiconductors, optoelectronics, sensors and microelectromechanical systems collectively represented the remaining 13.98% of market revenue in 2025. These categories are benefiting from new-energy vehicle electrification, 5G optical infrastructure, smart manufacturing and augmented and virtual reality applications. Domestic silicon carbide diode capacity is doubling approximately every 18 months, while locally fabricated vertical-cavity surface-emitting lasers are gaining traction in smartphone 3D-sensing systems.
Additional growth opportunities include automotive-grade silicon carbide and gallium nitride adoption in new-energy vehicle powertrains, as well as higher demand for radio-frequency front-end integrated circuits from China's 5G base-station deployment. Talent migration to overseas semiconductor design companies remains a potential constraint, reinforcing the importance of workforce development as China expands its semiconductor manufacturing and design capabilities.
Key Topics Covered:
1 INTRODUCTION
1.1 Study Assumptions and Market Definition
1.2 Scope of the Study
2 RESEARCH METHODOLOGY
3 EXECUTIVE SUMMARY
4 MARKET LANDSCAPE
4.1 Market Overview
4.2 Market Drivers
4.2.1 Accelerated "Made-in-China 2025" IC CAsia-Pacificity Expansion Programs
4.2.2 AI-centric Edge-Computing Demand from Tier-1 Chinese Cloud Providers
4.2.3 Automotive-grade SiC/GaN Adoption in NEV Powertrains
4.2.4 National 5G Base-station Build-out Driving RF-Front-End IC Uptake
4.2.5 Industrial Upgrade to "Industry 4.0" Smart-Factories
4.2.6 Post-pandemic rebound of AIoT-enabled consumer devices (smart wearables, AR/VR)
4.3 Market Restraints
4.3.1 US Export-control Entity-List Restrictions on EUV and EDA Tools
4.3.2 Talent Drain to Overseas Design Houses
4.3.3 Electricity-Intensive Fabs Facing Provincial Carbon-Quota Caps
4.3.4 Persistent Price Volatility of 300 mm Prime Wafers
4.4 Industry Value Chain Analysis
4.5 Regulatory Outlook
4.6 Technological Trends
4.7 Porter's Five Forces Analysis
4.7.1 Threat of New Entrants
4.7.2 Bargaining Power of Buyers
4.7.3 Bargaining Power of Suppliers
4.7.4 Threat of Substitutes
4.7.5 Intensity of Rivalry
4.8 Impact Assessment of Macroeconomic Factors
4.9 Semiconductor Foundry Landscape
4.9.1 Foundry Revenue and Share by Players
4.9.2 IDM vs Fabless Sales
4.9.3 Installed Wafer CAsia-Pacificity (by Fab Location)
5 MARKET SIZE AND GROWTH FORECASTS (VALUE)
5.1 By Device Type (Shipment Volume for Device Type is Complementary)
5.1.1 Discrete Semiconductors
5.1.1.1 Diodes
5.1.1.2 Transistors
5.1.1.3 Power Transistors
5.1.1.4 Rectifier and Thyristor
5.1.1.5 Other Discrete Devices
5.1.2 Optoelectronics
5.1.2.1 Light-Emitting Diodes (LEDs)
5.1.2.2 Laser Diodes
5.1.2.3 Image Sensors
5.1.2.4 Optocouplers
5.1.2.5 Other Device Types
5.1.3 Sensors and MEMS
5.1.3.1 Pressure
5.1.3.2 Magnetic Field
5.1.3.3 Actuators
5.1.3.4 Acceleration and Yaw Rate
5.1.3.5 Temperature and Others
5.1.4 Integrated Circuits
5.1.4.1 By Integrated Circuit Type
5.1.4.1.1 Analog
5.1.4.1.2 Micro
5.1.4.1.2.1 Microprocessors (MPU)
5.1.4.1.2.2 Microcontrollers (MCU)
5.1.4.1.2.3 Digital Signal Processors
5.1.4.1.3 Logic
5.1.4.1.4 Memory
5.1.4.2 By Technology Node (Shipment Volume Not Applicable)
5.1.4.2.1 < 3nm
5.1.4.2.2 3nm
5.1.4.2.3 5nm
5.1.4.2.4 7nm
5.1.4.2.5 16nm
5.1.4.2.6 28nm
5.1.4.2.7 > 28nm
5.2 By Business Model
5.2.1 IDM
5.2.2 Design/ Fabless Vendor
5.3 By End-user Industry
5.3.1 Automotive
5.3.2 Communication (Wired and Wireless)
5.3.3 Consumer
5.3.4 Industrial
5.3.5 Computing/Data Storage
5.3.6 Data Center
5.3.7 AI
6 COMPETITIVE LANDSCAPE
6.1 Market Concentration
6.2 Strategic Moves
6.3 Market Share Analysis
6.4 Company Profiles (includes Global level Overview, Market level overview, Core Segments, Financials as available, Strategic Information, Market Rank/Share for key companies, Products and Services, and Recent Developments)
6.4.1 Semiconductor Manufacturing International Corp (SMIC)
6.4.2 Taiwan Semiconductor Manufacturing Co (TSMC)
6.4.3 Hua Hong Group
6.4.4 Intel Corp
6.4.5 Samsung Electronics Co Ltd
6.4.6 SK Hynix Inc
6.4.7 Micron Technology Inc
6.4.8 Yangtze Memory Technologies Co (YMTC)
6.4.9 JCET Group Co Ltd
6.4.10 Advanced Micro Devices Inc
6.4.11 Qualcomm Inc
6.4.12 Broadcom Inc
6.4.13 Nvidia Corp
6.4.14 NXP Semiconductors NV
6.4.15 Infineon Technologies AG
6.4.16 STMicroelectronics NV
6.4.17 Texas Instruments Inc
6.4.18 Will Semiconductor Co Ltd
6.4.19 Goodix Technology
6.4.20 ASE Technology Holding Co
6.4.21 Renesas Electronics Corp
6.4.22 Rohm Co Ltd
7 MARKET OPPORTUNITIES AND FUTURE OUTLOOK
7.1 White-space and Unmet-Need Assessment
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