Madhya Pradesh Advances ₹6,200 Crore Semiconductor Packaging Project Arabian Post
The two-day summit, inaugurated on Friday at the Brilliant Convention Centre, attracted investment proposals worth approximately ₹5,800 crore, potentially generating more than 10,000 jobs. Separately, five companies received letters of intent for land allocation covering projects valued at ₹9,625 crore.
The proposed semiconductor facility, involving Paras Semiconductors, a subsidiary of Paras Defence and Space Technologies, represents one of the state's largest identified investments in advanced chip packaging. The company signed a memorandum of understanding with the state government on July 22 for a greenfield outsourced semiconductor assembly and testing plant.
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